beeldscherm schreef op 27 april 2013 13:16:
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Focus on Cost of Ownership— at the European 3D TSV Summit
February 5, 2013
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Finally, we come to the chip stacking processes themselves. Lindner and Hannes Kostner, of Besi, both talked about the ongoing collaboration with EVG and Besi on their advanced chip to wafer process, which involves an integrated system for die placement followed by a permanent collective bond.
With a solid background in HVM flip chip bonders, Besi is leveraging that core competency to develop a thermocompression die bonder that meets the requirements for stacking TSV die such as thin die handling, accuracy, coplanarity and bond control. Kostner reported that the first tool buyoff was successful with a first time dual head/single pass assembly of multilayer TSV stacks at 50µ die thickness. The second evaluation is currently underway, and 27 companies have decided to use TCB technology “sooner or later.”
I found the mere presence of Besi at the TSV Summit to be significant, because it signifies that we are on the path to HVM. “We had to see a HVM application before committing development costs in to high volume tool,” explained Kostner. “Wide I/O DRAM is that application.”
So there you have it. Progress is clearly being made and I expect future charts at subsequent events to show lower CoO is happening. Stay tuned for more on the European 3D TSV Summit.