Bonding Head With A Heatable And Coolable Suction Member
Application number: 20140202636
Abstract: A bonding head for mounting semiconductor chips on a substrate comprises a bonding head body and a suction member formed of a single piece. The elements necessary for heating, cooling and monitoring the temperature of the suction member are all integrated into the suction member, so that neither the heating nor the cooling elements are separated from the semiconductor chip by a surface preventing the heat transfer. The bonding head body contains only the elements necessary for supplying the suction member with electrical power and with the cooling medium.
Type: Application
Filed: January 17, 2014
Issued: July 24, 2014
Assignee: Besi Switzerland AG
Inventor: Andreas Mayr
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Thermocompression Bonding Method And Apparatus For Mounting Semiconductor Chips On A Substrate
Application number: 20140175159
Abstract: A thermocompression bonding method for mounting semiconductor chips on a substrate comprises: picking up the semiconductor chip with a chip gripper displaceably mounted on a TC bonding head; positioning of the chip gripper above the assigned substrate location; lowering the TC bonding head up to a position in which the chip gripper is deflected by a predetermined distance relative to the TC bonding head; heating of the semiconductor chip to a temperature above the melting point of the solder, so that the deflection of the chip gripper becomes zero again; waiting until the temperature of the semiconductor chip has fallen to a value beneath the melting temperature of the solder, and lifting of the TC bonding head.
Type: Application
Filed: December 20, 2013
Issued: June 26, 2014
Assignee: Besi Switzerland AG
Inventor: Hannes Kostner
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Method For Detaching A Semiconductor Chip From A Foil
Application number: 20140196853
Abstract: The invention relates to the prepeeling phase of methods for detaching a semiconductor chip from a foil. According to a first aspect, the invention relates to the determination of time periods, which each defines a duration of a prepeeling step. In a setup phase, the following steps are carried out for each prepeeling step: Initiating the method step; Repeating the two steps Recording of an image of the semiconductor chip and assignment of a time period to the image which has passed since the initiation of the prepeeling step, and Checking whether in the image a peripheral region of the semiconductor chip is darker than a predetermined brightness value; until the check leads to the result that no peripheral region of the semiconductor chip is darker than the predetermined brightness value. According to a second aspect, the detachment of the semiconductor chip from the foil is monitored in realtime.
Type: Application
Filed: November 20, 2013
Issued: July 17, 2014
Assignee: Besi Switzerland AG
Inventors: Ernst Barmettler, Irving Rodriguez