Mon, Nov 25,2013
CORWIL increases molding capabilities with a FICO MMS-W molding system
This next generation molding machine also includes vacuum assisted molding
This next generation molding machine also includes vacuum assisted molding
News | CIOL Bureau
MILPITAS, USA: CORWIL Technology announced the addition of a new FICO MMS-W molding system. With this system, CORWIL has developed the capability of offering industry standard QFN packages that feature an MSL moisture sensitivity level of 1, per J-STD-020, with a maximum peak reflow temperature of 260 C. This next generation multi plunger molding machine also includes "vacuum assisted molding" which further enhances quality.
This addition, coupled with our recent addition of the ASM Xtreme wire bonder, strengthens CORWIL's capability for fine pitch, high density packaging for BGA, QFN and CSP products with complex multi-tier wire bonding layout using wire size down to 0.5 mil.
"As several of our Mil/Aero customers migrate from conventional ceramic packaging to plastic packaging, CORWIL identified a critical need for a molding system that would satisfy the needs of these demanding customers. With this system, CORWIL has the right molding capabilities to service this market," said Willy Bowman, CORWIL's director of engineering.
"Our search for the right molding partner led us to FICO who was able to deliver a system that helps us meet the stringent quality requirements of our mil/aero & medical customers as well as providing the flexibility required for commercial and quick-turn customers."
This purchase emphasizes CORWIL's commitment to acquire the best equipment and capabilities to serve the semiconductor industry's domestic outsourced assembly and test requirements.