beeldscherm schreef op 13 augustus 2014 19:31:
positiv headway in front of us to 2014,increasing marketshare,this year outgrowing significally,big custumers are Apple, Intel.
flip chip is moving faster then wire bonding
we can deliver better solutions to our big customers then our Asian rivals.
now between 4 to 5 weeks we can deliver new machine to custumers, was 8 weeks.
several new technologies working on
dit waren/zijn een paar raakwoorden uit de conference,nu zijn de vragen aan de beurt.
wsw.com/webcast/canaccord14/besiy/