;) Ok, bij deze in het Engels dan ook.
Lightwave Logic Announces Publication of U.S. Patent Application for New Hybrid Photonics to Enable Improved Modulator Fabrication in High-Volume Foundry Manufacturing
New Patent Application to Simplify Fabrication of Polymer Modulators Designed to Integrate with Silicon Photonics to Enable Enhanced Internet Traffic Flow and Reduced Energy Usage
ENGLEWOOD, Colo., April 19, 2022 /PRNewswire/ -- Lightwave Logic, Inc. (NASDAQ: LWLG), a technology platform company leveraging its proprietary electro-optic polymers to transmit data at higher speeds with less power, today announced the publication of a U.S. patent application on a new invention that will simplify polymer modulator fabrication when integrated with silicon photonics for high-volume foundry manufacturing applications.
This patent application - entitled "TFP (thin film polymer) optical transition device and method," - illustrates the design of a simpler to fabricate, lower cost hybrid integrated photonics chip using electro-optic polymers which are more advantageous for high-volume production. The simplified fabrication approach enables us to simplify the production of very high speed, low power proprietary polymer modulators that will enable significantly faster data rates in the internet environment.
The essence of the invention is a hybrid polymer-silicon photonics engine that fits into fiber optic transceivers (either pluggable or co-packaged) that are used in the routers, servers and network equipment that are proliferating with the growth of data centers, cloud computing and optical communications capacity. The hybrid polymer-silicon photonics engine is designed to use high-volume silicon foundry infrastructure and is published with publication number 2022/0113566 A1.
Dr. Michael Lebby, Chief Executive Officer of Lightwave Logic commented, "This patent application is core to our drive to provide a hybrid integrated photonics platform to boost the performance of silicon photonics technologies using our proprietary electro-optic polymers. The patent application teaches the simplicity of fabricating the design in standard large volume silicon foundries, further simplifying manufacturing for our foundry partners.
"This is another important addition to our IP portfolio that allows our polymer technology platform to become the engine for pluggable fiber optic transceivers that are being utilized throughout internet infrastructure. You need simplicity and efficiency in chip design for foundries, and this patent application serves that purpose acutely. With this patent application, we are changing the internet and enabling faster data - improving the lives of countless millions who rely on the internet to work, play and communicate," concluded Lebby.